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 MC74LCX573 Low-Voltage CMOS Octal Transparent Latch Flow Through Pinout
With 5 V-Tolerant Inputs and Outputs (3-State, Non-Inverting)
The MC74LCX573 is a high performance, non-inverting octal transparent latch operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX573 inputs to be safely driven from 5.0 V devices. The MC74LCX573 contains 8 D-type latches with 3-state standard outputs. When the Latch Enable (LE) input is HIGH, data on the Dn inputs enters the latches. In this condition, the latches are transparent, i.e., a latch output will change state each time its D input changes. When LE is LOW, the latches store the information that was present on the D inputs a setup time preceding the HIGH-to-LOW transition of LE. The 3-state standard outputs are controlled by the Output Enable (OE) input. When OE is LOW, the standard outputs are enabled. When OE is HIGH, the standard outputs are in the high impedance state, but this does not interfere with new data entering into the latches. The LCX573 flow through design facilitates easy PC board layout.
Features http://onsemi.com MARKING DIAGRAMS
20 SOIC-20 DW SUFFIX CASE 751D 1 LCX573 AWLYYWWG
20 1
20 TSSOP-20 DT SUFFIX CASE 948E 1 LCX 573 ALYWG G
20 1
20 SOEIAJ-20 M SUFFIX CASE 967 1 74LCX573 AWLYWWG
* * * * * * * *
Designed for 2.3 to 3.6 V VCC Operation 5.0 V Tolerant - Interface Capability With 5.0 V TTL Logic Supports Live Insertion and Withdrawal IOFF Specification Guarantees High Impedance When VCC = 0 V LVTTL Compatible LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current in All Three Logic States (10 mA) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA Human Body Model >2000 V Machine Model >200 V Pb-Free Packages are Available*
20 1
A = Assembly Location L, WL = Wafer Lot Y, YY = Year W, WW = Work Week G = Pb-Free Package G = Pb-Free Package (Note: Microdot may be in either location)
* * ESD Performance: *
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2005
1
May, 2005 - Rev. 7
Publication Order Number: MC74LCX573/D
MC74LCX573
OE LE 1 11 nLE Q D 18 Q D 17 Q D 16 Q D nLE Q D 14 Q D nLE Q D 12 Q D O7 13 O6 O5 15 O4 O3 O2 O1 19 O0
VCC 20
O0 19
O1 18
O2 17
O3 16
O4 15
O5 14
O6 13
O7 12
LE 11
2 D0
3 D1 1 OE 2 D0 3 D1 4 D2 5 D3 6 D4 7 D5 8 D6 9 D7 10 GND 4 D2
nLE
nLE
Figure 1. Pinout (Top View)
5 D3 nLE
PIN NAMES
PINS OE LE D0-D7 O0-O7 FUNCTION Output Enable Input Latch Enable Input Data Inputs 3-State Latch Outputs D4
6
7 D5
nLE
8 D6
9 D7
nLE
Figure 2. Logic Diagram TRUTH TABLE
INPUTS OE L L L L L H H H H H LE H H L L L L H H L L Dn H L h l X X H L h l OUTPUTS On H L H L NC Z Z Z Z Z OPERATING MODE Transparent (Latch Disabled); Read Latch Latched (Latch Enabled) Read Latch Hold; Read Latch Hold; Disabled Outputs Transparent (Latch Disabled); Disabled Outputs Latched (Latch Enabled); Disabled Outputs
H = High Voltage Level; h = High Voltage Level One Setup Time Prior to the Latch Enable High-to-Low Transition L = Low Voltage Level l = Low Voltage Level One Setup Time Prior to the Latch Enable High-to-Low Transition NC = No Change, State Prior to the Latch Enable High-to-Low Transition X = High or Low Voltage Level or Transitions are Acceptable Z = High Impedance State For ICC Reasons DO NOT FLOAT Inputs
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MC74LCX573
MAXIMUM RATINGS
Symbol VCC VI VO IIK IOK IO ICC IGND Parameter DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Source/Sink Current DC Supply Current Per Supply Pin DC Ground Current Per Ground Pin Value -0.5 to +7.0 -0.5 VI +7.0 -0.5 VO +7.0 -0.5 VO VCC + 0.5 -50 -50 +50 50 100 100 Output in 3-State Output in HIGH or LOW State (Note 1) VI< GND VO < GND VO > VCC Condition Unit V V V V mA mA mA mA mA mA
TSTG Storage Temperature Range -65 to +150 C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed.
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VI VO IOH Supply Voltage Input Voltage Output Voltage HIGH Level Output Current (HIGH or LOW State) (3-State) VCC = 3.0 V - 3.6 V VCC = 2.7 V - 3.0 V VCC = 2.3 V - 2.7 V VCC = 3.0 V - 3.6 V VCC = 2.7 V - 3.0 V VCC = 2.3 V - 2.7 V -40 0 Parameter Operating Data Retention Only Min 2.0 1.5 0 0 0 Typ 2.5, 3.3 2.5, 3.3 Max 3.6 3.6 5.5 VCC 5.5 - 24 - 12 -8 + 24 + 12 +8 +85 10 Unit V V V mA
IOL
LOW Level Output Current
mA
TA Dt/DV
Operating Free-Air Temperature Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V
C ns/V
ORDERING INFORMATION
Device MC74LCX573DW MC74LCX573DWG MC74LCX573DWR2 MC74LCX573DWR2G MC74LCX573DT MC74LCX573DTG MC74LCX573DTR2 MC74LCX573DTR2G MC74LCX573M MC74LCX573MG MC74LCX573MEL Package SOIC-20 SOIC-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) TSSOP-20* TSSOP-20* TSSOP-20* TSSOP-20* SOEIAJ-20 SOEIAJ-20 (Pb-Free) SOEIAJ-20 Shipping 38 Units / Rail 38 Units / Rail 1000 Tape & Reel 1000 Tape & Reel 75 Units / Rail 75 Units / Rail 2000 Tape & Reel 2000 Tape & Reel 40 Units / Rail 40 Units / Rail 2000 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free.
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MC74LCX573
DC ELECTRICAL CHARACTERISTICS
TA = -40C to +85C Symbol VIH Characteristic HIGH Level Input Voltage (Note 2) Condition 2.3 V VCC 2.7 V 2.7 V VCC 3.6 V VIL LOW Level Input Voltage (Note 2) 2.3 V VCC 2.7 V 2.7 V VCC 3.6 V VOH HIGH Level Output Voltage 2.3 V VCC 3.6 V; IOL = 100 mA VCC = 2.3 V; IOH = -8 mA VCC = 2.7 V; IOH = -12 mA VCC = 3.0 V; IOH = -18 mA VCC = 3.0 V; IOH = -24 mA VOL LOW Level Output Voltage 2.3 V VCC 3.6 V; IOL = 100 mA VCC = 2.3 V; IOL= 8 mA VCC = 2.7 V; IOL= 12 mA VCC = 3.0 V; IOL = 16 mA VCC = 3.0 V; IOL = 24 mA II IOZ IOFF ICC DICC Input Leakage Current 3-State Output Current Power-Off Leakage Current Quiescent Supply Current 2.3 V VCC 3.6 V; 0 V VI 5.5 V 2.3 VCC 3.6 V; 0V VO 5.5 V; VI = VIH or V IL VCC = 0 V; VI or VO = 5.5 V 2.3 VCC 3.6 V; VI = GND or VCC 2.3 VCC 3.6 V; 3.6 VI or VO 5.5 V Increase in ICC per Input 2.3 VCC 3.6 V; VIH = VCC - 0.6 V 2. These values of VI are used to test DC electrical characteristics only. VCC - 0.2 1.8 2.2 2.4 2.2 0.2 0.6 0.4 0.4 0.55 5 5 10 10 10 500 mA mA mA mA mA V Min 1.7 2.0 0.7 0.8 V V Max Unit V
AC CHARACTERISTICS tR = tF = 2.5 ns; RL = 500 W
Limits TA = -40C to +85C VCC = 3.3 V 0.3 V CL = 50 pF Symbol tPLH tPHL tPLH tPHL tPZH tPZL tPHZ tPLZ ts th tw tOSHL tOSLH Parameter Propagation Delay Dn to On Propagation Delay LE to On Output Enable Time to HIGH and LOW Level Output Disable Time From High and Low Level Setup TIme, HIGH or LOW Dn to LE Hold TIme, HIGH or LOW Dn to LE LE Pulse Width, HIGH Output-to-Output Skew (Note 3) Waveform 1 3 2 2 3 3 3 Min 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 2.5 1.5 3.3 1.0 1.0 Max 8.0 8.0 8.5 8.5 8.5 8.5 6.5 6.5 VCC = 2.7 V CL = 50 pF Min 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 2.5 1.5 3.3 Max 9.0 9.0 9.5 9.5 9.5 9.5 7.0 7.0 VCC = 2.5 V 0.2 V CL = 30 pF Min 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 4.0 2.0 4.0 ns Max 9.6 9.6 10.5 10.5 10.5 10.5 7.8 7.8 Unit ns ns ns ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH); parameter guaranteed by design.
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MC74LCX573
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25C Symbol VOLP VOLV Characteristic Dynamic LOW Peak Voltage (Note 4) Dynamic LOW Valley Voltage (Note 4) Condition VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V Min Typ 0.8 0.6 -0.8 -0.6 Max Unit V V V V
4. Number of outputs defined as "n". Measured with "n-1" outputs switching from HIGH-to-LOW or LOW-to-HIGH. The remaining output is measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol CIN CI/O CPD Parameter Input Capacitance Input/Output Capacitance Power Dissipation Capacitance Condition VCC = 3.3 V, VI = 0 V or VCC VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 3.3 V, VI = 0 V or VCC Typical 7 8 25 Unit pF pF pF
OE Vmi VCC Dn Vmi tPLH Vmo Vmi 0V tPHL VOH On Vmo VOL On WAVEFORM 1 - PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns tPZL Vmo tPLZ On tPZH Vmo tPHZ Vmi
VCC 0V VOH VHZ
VLZ VOL
WAVEFORM 2 - OUTPUT ENABLE AND DISABLE TIMES tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
2.7 V Dn 1.5 V 0V ts LE 1.5 V tw 1.5 V 0V tPLH, tPHL VOH On 1.5 V VOL th 2.7 V Symbol Vmi Vmo VHZ VLZ 3.3 V + 0.3 V 1.5 V 1.5 V VOL + 0.3 V VOL - 0.3 V VCC 2.7 V 1.5 V 1.5 V VOL + 0.3 V VOL - 0.3 V 2.5 V + 0.2 V VCC/2 VCC/2 VOL + 0.15 V VOL - 0.15 V
WAVEFORM 3 - LE to On PROPAGATION DELAYS, LE MINIMUM PULSE WIDTH, Dn to LE SETUP AND HOLD TIMES tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns except when noted
Figure 3. AC Waveforms
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5
MC74LCX573
VCC 6V OPEN GND
PULSE GENERATOR RT
R1 DUT CL RL
TEST tPLH, tPHL tPZL, tPLZ Open Collector/Drain tPLH and tPHL tPZH, tPHZ CL = CL = RL = RT =
SWITCH Open 6 V at VCC = 3.3 0.3 V 6 V at VCC = 2.5 0.2 V 6V GND
50 pF at VCC = 3.3 0.3 V or equivalent (includes jig and probe capacitance) 30 pF at VCC = 2.5 0.2 V or equivalent (includes jig and probe capacitance) R1 = 500 W or equivalent ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
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MC74LCX573
PACKAGE DIMENSIONS
SOIC-20 DW SUFFIX CASE 751D-05 ISSUE G
D
A
11 X 45 _
q
H
M
B
M
20
10X
0.25
E
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_
1
10
20X
B 0.25
M
B TA
S
B
S
A
SEATING PLANE
h
18X
e
A1
T
C
TSSOP-20 DT SUFFIX CASE 948E-02 ISSUE B
20X
K REF
M
L
0.15 (0.006) T U
S
0.10 (0.004)
TU
S
V
S
2X
L/2
L
PIN 1 IDENT 1 10
B -U-
J J1
N 0.15 (0.006) T U
S
A -V- N F
C D 0.100 (0.004) -T- SEATING
PLANE
G
H
DETAIL E
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7
IIII IIII IIII
SECTION N-N M DETAIL E
20
11
K K1
0.25 (0.010)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
-W-
DIM A B C D F G H J J1 K K1 L M
MC74LCX573
PACKAGE DIMENSIONS
SOEIAJ-20 M SUFFIX CASE 967-01 ISSUE O
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.18 0.27 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.81 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.032
20
11
LE Q1 M_ L DETAIL P
E HE
1
10
Z D e VIEW P A
c
b 0.13 (0.005)
M
A1 0.10 (0.004)
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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8
MC74LCX573/D


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